The TSIII implant was developed by the Osstem R&D team to be the ideal implant for any situation thanks to its carefully thought-out design and simplicity of use.


The slightly tapered body (1.5° taper) delivers excellent primary stability across bone types.


Provides a strong, tight implant–abutment connection, improving the chances of successful treatment.


The new precision-engineered 3-hole abutment system ensures a secure and permanent connection between the implant and abutment.


TS implants use only two platforms to connect the abutment across all diameters:
Mini : Implants with diameter Ø3.0 mm and Ø3.5 mm
Regular : Implants with diameters of Ø4.0 mm, Ø4.5 mm, Ø5.0 mm and Ø5.5 mm.


Optimal Surface Structure: A combination of macrostructure and microstructure that promotes fast cell response and bone healing, achieving a rate of healing that is 20% faster than traditional Resorbable Blasting Media (RBM) surfaces.
Early Loading: Helps shorten the healing time before loading.
Ideal Surface Roughness: Maintains a roughness of Ra 2.5–3.0 μm.
Enhanced Surface Area: The SA surface increases surface area by about 45% compared to RBM, thanks to its higher roughness.
Selecting the right size for each case involves detailed examinations, so OSSTEM offers a wide range of sizes to meet all needs.






With self-stopping drills, there is no need to monitor the drilling depth.


The multi-step drilling design facilitates a more efficient drilling process by removing the need for trial drilling.


OSSTEM's unique drilling sequence enhances surgical efficiency, reducing the time required for procedures.


Easy, precise procedures


Osstem offers a wide range of prosthetic components and accessories, allowing clinicians to choose the best option for each case and achieve optimal results.




















The TS implant system is the most widely used implant system among implantologists globally,
renowned for its exceptional design, efficient corkscrew thread, self-tapping capability, and reliable primary stability.













